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RENESAS LSIs 2003.08.21 Ver. 7.0
M5M5V416CWG -55HI, -70HI
4194304-BIT (262144-WORD BY 16-BIT) CMOS STATIC RAM
DESCRIPTION
The M5M5V416CWG is a f amily of low v oltage 4-Mbit static RAMs organized as 262144-words by 16-bit, f abricated by Renesas's high-perf ormance 0.18m CMOS technology . The M5M5V416C is suitable f or memory applications where a simple interf acing , battery operating and battery backup are the important design objectiv es. M5M5V416CWG is packaged in a CSP (chip scale package), with the outline of 7.0mm x 8.5mm, ball matrix of 6 x 8 (48ball) and ball pitch of 0.75mm. It giv es the best solution f or a compaction of m ounting area as well as f lexibility of wiring pattern of printed circuit boards. -
FEATURES
Single 2.7~3.6V power supply Small stand-by current: 0.2A (3.00V, ty p.) No clocks, No ref resh Data retention supply v oltage =2.0V All inputs and outputs are TTL compatible. Easy memory expansion by S1#, S2, BC1# and BC2# Common Data I/O Three-state outputs: OR-tie capability OE# prev ents data contention in the I/O bus Process technology : 0.18m CMOS Package: 48ball 7.0mm x 8.5mm CSP
Version, Operating temperature Part name
Power Supply
Access time
* Typical(3.0V)
max.
55ns
Activ e current Ratings (max. @3.6V) Icc1 25C 40C Voltage 25C 40C 70C 85C (3.0V, ty p.) Stand-by c urrent (A) 3.0V 0.2 0.4 3.3V 3.6V 1.0 1.5 2.5 2.0 2.5 4.0 10 10 10 20 20 20
30mA (10MHz) 5mA (1MHz)
I-version
-40 ~ +85C
M5M5V416CWG -55HI
2.7 ~ 3.6V
M5M5V416CWG -70HI
70ns
* Typical parameter indicates the value for the center of distribution, and not 100% tested.
PIN CONFIGURATION
(TOP VIEW)
1 A B C D E F G H
BC1#
2
OE#
3
A0
4
A1
5
A2
6
S2
DQ16
BC2#
A3
A4
S1#
DQ1
Pin
Function
DQ14
DQ15
A5
A6
DQ2
DQ3
GND
DQ13
A17
A7
DQ4
VCC
A0 ~ A17 Address input DQ1 ~ DQ16 Data input / output Chip select input 1 S1# S2 W# OE# BC1# BC2# Vcc GND Chip select input 2 Write control input Output enable input Lower By te (DQ1 ~ 8) Upper By te (DQ9 ~ 16) Power supply Ground supply
VCC
DQ12
NC or GND
A16
DQ5
GND
DQ11
DQ10
A14
A15
DQ7
DQ6
DQ9
N.C.
A12
A13
W#
DQ8
NC
A8
A9
A10
A11
N.C.
Outline: 48FJA NC: No Connection
*Don't connect E3 ball to voltage level more than 0V.
1
RENESAS LSIs 2003.08.21 Ver. 7.0
M5M5V416CWG -55HI, -70HI
4194304-BIT (262144-WORD BY 16-BIT) CMOS STATIC RAM
FUNCTION
The M5M5V416CWG is organized as 262144-words by 16-bit. These dev ices operate on a single +2.7~3.6V power supply , and are directly TTL compatible to both input and output. Its f ully s t atic circuit needs no clocks and no ref resh, and makes it usef ul. The operation mode are determined by a combination of the dev ice control inputs BC1# , BC2# , S1#, S2 , W# and OE#. Each mode is summarized in the f unction table. A write operation is executed whenev er the low lev el W# ov erlaps with the low lev el BC1# and/or BC2# and the low lev el S1# and the high lev el S2. The address(A0~A17) must be set up bef ore the write cy c le and must be stable during the entire cy c le. A read operation is executed by s etting W# at a high lev el and OE# at a low lev el while BC1# and/or BC2# and S1# and S2 are in an activ e state(S1#=L,S2=H). When setting BC1# at the high lev el and other pins are in an activ e stage , upper-by t e are in a selectable mode in which both reading and writing are enabled, and lower-by t e are in a non-selectable mode. And when setting BC2# at a high lev el and other pins are in an activ e stage, lowerby t e are in a selectable mode and upper-by te are in a non-selectable mode. When setting BC1# and BC2# at a high lev el or S1# at a high lev el or S2 at a low lev el, the chips are in a nonselectable mode in which both reading and writing are disabled. In this mode, the output stage is in a highimpedance state, allowing OR-tie with other chips and memory expansion by BC1#, BC2# and S1#, S2. The power supply c urrent is reduced as low as 0.2A(25C, ty pical), and the memory data can be held at +2V power supply , enabling battery back-up operation during power f ailure or power-down operation in the non-selected mode.
FUNCTION TABLE
DQ9~16 Icc High-Z High-Z Standby XL XXXX H H X X X X Non selection High-Z High-Z Standby XX H H X X Non selection High-Z High-Z Standby High-Z Activ e HLX Din LHL Write Dout High-Z Activ e LHLHHL Read LHLHHH High-Z High-Z Activ e LHHLL X High-Z Din Activ e Write LHHLHL High-Z Dout Activ e Read High-Z High-Z Activ e LHHLHH LHL LLX Din Din Activ e Write LHL LHL Dout Dout Activ e Read LHH High-Z High-Z Activ e LHL (note) "H" and "L" in this table mean VIH and VIL, respectiv ely . "X" in this table should be "H" or "L".
S1# S2 BC1# BC2# W# OE#
Mode
DQ1~8
Non selection
BLOCK DIAGRAM
A0 A1
DQ 1
MEMORY ARRAY 262144 WORDS x 16 BITS A16 A17 S1# S2
BC1# CLOCK GENERATOR -
DQ 8
DQ 9
DQ 16
BC2#
Vcc
W# GND OE#
2
RENESAS LSIs 2003.08.21 Ver. 7.0
M5M5V416CWG -55HI, -70HI
4194304-BIT (262144-WORD BY 16-BIT) CMOS STATIC RAM
ABSOLUTE MAXIMUM RATINGS
Symbol Parameter Supply v oltage Input v oltage Output v oltage Power dissipation Operating temperature Storage temperature Conditions With respect to GND With respect to GND With respect to GND Ta=25C I-v ersion Ratings Units
Vcc VI VO Pd Ta T stg
-0.5* ~ +4.6 -0.3* ~ Vcc + 0.3 0 ~ Vcc 700 - 40 ~ +85 - 65 ~ +150
* -3.0V in case of AC (Pulse width < 30ns)
V mW
C C
DC ELECTRICAL CHARACTERISTICS
Symbol
( Vcc=2.7 ~ 3.6V, unless noted. ) Limits Min Ty p Max Vcc+0.2V Units
Parameter High-lev el input v oltage Low-lev el input v oltage
High-level output voltage
Conditions
VIH VIL VOH VOL II IO
Low-lev el output v oltage Input leakage current Output leakage current ( AC,MOS lev el )
IOH= -0.5mA IOL=2mA VI =0 ~ Vcc
BC1# and BC2# =VIH or S1# =VIH or S2=VIL or OE# =VIH, VI/O=0 ~ Vcc BC1# and BC2# < 0.2V, S1# < 0.2V, S2 > Vcc-0.2V other inputs < 0.2V or > Vcc-0.2V Output - open (duty 100% )
2.2 -0.2 * 2.4
0.4 0.4 1 1 50 10 50 10 1.0 1.5 2.5 2.0 2.5 4.0 10 20 2
V
A
Icc1 Activ e supply c urrent
f = 10MHz f = 1MHz f = 10MHz f = 1MHz
Activ e supply c urrent Icc2 ( AC,TTL lev el )
BC1# and BC2# =V IL , S1# =V IL ,S2=V IH other pins =V IH or VIL Output - open (duty 100%)
-
30 5 30 5 0.2
mA
~ +25C
(1) S1# > Vcc - 0.2V,
Icc3 Stand by s upply current
( MOS lev el )
S2 > Vcc - 0.2V, other inputs = 0 ~ Vcc (2) S2 < 0.2V, other inputs = 0 ~ Vcc (3) BC1# and BC2# > Vcc - 0.2V S1# < 0.2V, S2 > Vcc - 0.2V other inputs = 0 ~ Vcc
3.0V 3.3V 3.6V 3.0V 3.3V 3.6V
3.0V~3.6V 3.0V~3.6V
~ +40C
-
0.4 -
A
~ +70C ~ +85C
Icc4 Stand by s upply current
( TTL lev el )
BC1# and BC2# =VIH or S1# =VIH or S2=VIL Other inputs= 0 ~ Vcc
mA
Note 1: Direction for current flowing into IC is indicated as positive (no mark)
* -1.0V in case of AC (Pulse width < 30ns)
Note 2: Typical parameter indicates the value for the center of distribution at 3.00V, and is not 100% tested.
CAPACITANCE
Symbol Parameter Input capacitance Output capacitance Conditions
(Vcc=2.7 ~ 3.6V, unless noted. ) Limits Ty p Units
Min VI=GND, VI=25mVrms, f =1MHz VO=GND,VO=25mVrms, f =1MHz
Max
CI CO
10 10
pF
3
RENESAS LSIs 2003.08.21 Ver. 7.0
M5M5V416CWG -55HI, -70HI
4194304-BIT (262144-WORD BY 16-BIT) CMOS STATIC RAM
AC ELECTRICAL CHARACTERISTICS (1) TEST CONDITIONS
Supply v oltage
(Vcc=2.7 ~ 3.6V, unless noted. )
2.7~3.6V Input pulse VIH=2.4V, VIL=0.2V Input rise time and f all time 5ns
Ref erence lev el Output loads
1TTL DQ CL
Including scope and jig capacitance
VOH=VOL=1.50V
Transition is measured 200mV from steady state voltage.(for ten,tdis)
Fig.1,CL=30pF CL=5pF (for ten,tdis)
Fig.1 Output load
(2) READ CYCLE
Limits Symbol tCR Parameter Read cy cle time Address access time Chip select 1 access time Chip select 2 access time By te control 1 access time By te control 2 access time Output enable access time Output disable time af t er S1# high Output disable time af t er S2 low Output disable time af t er BC1# high Output disable time af t er BC2# high Output disable time af t er OE# high Output enable time af ter S1# low Output enable time af ter S2 high Output enable time af ter BC1# low Output enable time af ter BC2# low Output enable time af ter OE# low Data v alid time after address Limits
55HI
Min 55 Max 55 55 55 55 55 30 20 20 20 20 20 10 10 5 5 5 10 10 10 5 5 5 10
70HI
Min 70 Max 70 70 70 70 70 35 25 25 25 25 25
Units ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns
ta(A) ta(S1) ta(S2) ta(BC1) ta(BC2) ta(OE) tdis (S1) tdis (S2) tdis (BC1) tdis (BC2) tdis (OE) ten(S1) ten(S2) ten(BC1) ten(BC2) ten(OE) tV(A)
(3) WRITE CYCLE
Limits Symbol Parameter Write cy cle time Write pulse width Address setup time Address setup time with respect to W# By te control 1 setup time By te control 2 setup time Chip select 1 setup time Chip select 2 setup time Data setup time Data hold time Write recov ery time Output disable time f rom W# low Output disable time f rom OE# high Output enable time f rom W# high Output enable time f rom OE# low Limits
55HI
Min 55 45 0 50 50 50 50 50 30 0 0 Max
70HI
Min 70 55 0 60 60 60 60 60 35 0 0 Max
Units ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns
tCW tw(W) tsu(A) tsu(A-WH) tsu(BC1) tsu(BC2) tsu(S1) tsu(S2) tsu(D) th(D) trec(W) tdis (W) tdis (OE) ten(W) ten(OE)
20 20 5 5 5 5
25 25
4
RENESAS LSIs 2003.08.21 Ver. 7.0
M5M5V416CWG -55HI, -70HI
4194304-BIT (262144-WORD BY 16-BIT) CMOS STATIC RAM
(4)TIMING DIAGRAMS Read cycle
A0~17 ta(A) BC1#,BC2#
(Note3)
tCR
tv (A)
ta(BC1) or ta(BC2) tdis (BC1) or tdis (BC1) ta(S1)
(Note3) (Note3)
S1#
tdis (S1) ta(S2)
(Note3)
S2
(Note3)
tdis (S2) ta (OE)
(Note3)
OE#
(Note3) W# = "H" lev el
ten (OE) ten (BC1) ten (BC2) ten (S1) ten (S2) tCW
tdis (OE)
(Note3)
DQ1~16
VALID DATA
Write cycle (W# control mode )
A0~17
tsu (BC1) or tsu(BC2) BC1#,BC2#
(Note3) (Note3)
S1#
(Note3)
tsu (S1)
(Note3)
S2
(Note3)
tsu (S2)
(Note3)
OE# tsu (A) W# tdis(OE) DQ1~16
tsu (A-WH) tw (W) tdis (W)
trec (W) ten(OE) ten (W)
DATA IN STABLE
tsu (D)
th (D)
5
RENESAS LSIs 2003.08.21 Ver. 7.0
M5M5V416CWG -55HI, -70HI
4194304-BIT (262144-WORD BY 16-BIT) CMOS STATIC RAM
Write cycle (BC# control mode)
A0~17 tsu (A) BC1#,BC2#
tCW
tsu (BC1) or tsu (BC2)
trec (W)
S1#
(Note3) (Note3)
S2
(Note3) (Note5) (Note4) (Note3) (Note3) (Note3)
W#
tsu (D) DQ1~16
DATA IN STABLE
th (D)
Note 3: Hatching indicates the state is "don't care". Note 4: A Write occurs during S1# low, S2 high ov erlaps BC1# and/or BC2# low and W# low. Note 5: When the f alling edge of W# is simultaneously or prior to the f alling edge of BC1# and/or BC2# or the f alling edge of S1# or rising edge of S2, the outputs are maintained in the high impedance state. Note 6: Don't apply inv erted phase signal externally when DQ pin is in output mode.
6
RENESAS LSIs 2003.08.21 Ver. 7.0
M5M5V416CWG -55HI, -70HI
4194304-BIT (262144-WORD BY 16-BIT) CMOS STATIC RAM
Write cycle (S1# control mode)
A0~17
tCW
BC1#,BC2#
(Note3)
tsu (A)
tsu (S1)
trec (W)
(Note3)
S1#
S2
(Note3) (Note5) (Note3)
W#
(Note3)
(Note4)
tsu (D)
DATA IN STABLE
th (D)
(Note3)
DQ1~16
Write cycle (S2 control mode)
A0~17
tCW
BC1#,BC2#
(Note3)
tsu (A)
tsu (S2)
trec (W)
(Note3)
S1#
S2
(Note3) (Note5) (Note3)
W#
(Note3)
(Note4)
tsu (D)
DATA IN STABLE
th (D)
(Note3)
DQ1~16
7
RENESAS LSIs 2003.08.21 Ver. 7.0
M5M5V416CWG -55HI, -70HI
4194304-BIT (262144-WORD BY 16-BIT) CMOS STATIC RAM
POWER DOWN CHARACTERISTICS (1) ELECTRICAL CHARACTERISTICS
Symbol Vcc Parameter Test conditions Min Limits Ty p Max Units V Vcc(PD) V V
(PD) Power down supply voltage Byte control input BC1# & BC2#
2.0
2.2V < Vcc(PD) 2.0V < Vcc(PD) < 2.2V 2.2V < Vcc(PD)
VI (BC)
2.2 2.2
Vcc(PD) ~ +25C ~ +40C ~ +70C ~ +85C
VI (S1) VI (S2)
Chip select input S1# Chip select input S2
2.0V < Vcc(PD) < 2.2V
Vcc=2.0V
(1) S1# > Vcc - 0.2V,
-
0.05 0.1 -
0.2 0.8 1.5 7.5 15
V
Icc
(PD)
Power down supply c urrent
other inputs = 0 ~ Vcc (2) S2 < 0.2V, other inputs = 0 ~ Vcc
A
(3) BC1# and BC2# > Vcc - 0.2V
S1# < 0.2V, S2 > Vcc - 0.2V other inputs = 0 ~ Vcc
(2) TIMING REQUIREMENTS
Symbol Parameter Power down set up time Power down recov ery t ime
Note 7: Typical parameter of Icc(PD) indicates the value for the center of distribution at 2.0V, and not 100% tested.
Limits Test conditions Min Ty p Max
Units ns ms
tsu (PD) trec (PD)
0 5
(3) TIMING DIAGRAM
BC# control mode On the BC# control mode, the lev el of S1# and S2 must be f ixed at S1# , S2 > Vcc-0.2V or S2 < 0.2V. Vcc tsu (PD) 2.2V BC1# BC2# BC1# , BC2# > Vcc-0.2V 2.7V 2.7V trec (PD) 2.2V
S1# control mode On the S1# mode, the lev el of S2 must be f ixed at S2 > Vcc-0.2V or S2 < 0.2V. Vcc tsu (PD) 2.2V S1# S2 control mode Vcc S2 tsu (PD) 0.2V S2 < 0.2V 2.7V 2.7V trec (PD) 0.2V S1# > Vcc-0.2V 2.7V 2.7V trec (PD) 2.2V
8
RENESAS LSIs 2003.08.21 Ver. 7.0
M5M5V416CWG -55HI, -70HI
4194304-BIT (262144-WORD BY 16-BIT) CMOS STATIC RAM
Nippon Bldg.,6-2,Otemachi 2-chome,Chiyoda-ku,Tokyo,100-0004 Japan
Keep safety first in your circuit designs!
* Renesas Technology Corporation puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage.Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap.
Notes regarding these materials
* These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corporation product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corporation or a third party. * Renesas Technology Corporation assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials. * All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of publication of these materials, and are subject to change by Renesas Technology Corporation without notice due to product improvements or other reasons. It is therefore recommended that customers contact Renesas Technology Corporation or an auth orized Renesas Technology Corporation product distributor for the latest product information before purchasing a product listed herein. The information described here may contain technical inaccuracies or typographical errors. Renesas Technology Corporation assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors. Please also pay attention to information published by Renesas Technology Corporation by various means, including the Renesas Technology Corporation Semiconductor home page (http://www.renesas.com). * When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total system before making a fi nal decision on the applicability of the information and products. Renesas Technology Corporation assumes no responsibility for any damage, liability or other loss resulting from the information contained herein. * Renesas Technology Corporation semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life is potentially at stake. Please contact Renesas Technology Corporation or an authorized Renesas Technology Corporation product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use. * The prior written approval of Renesas Technology Corporation is necessary to reprint or reproduce in whole or in part these materials. * If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and cannot be imported into a country other than the approved destination. Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited. * Please contact Renesas Technology Corporation for further details on these materials or the products contained therein.
REJ03C0106 (c) 2003 Renesas Technology Corp. New publication, effective Apr. 2003. Specifications subject to change without notice

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